Category single-sided, double-sided, multi-layer
Laminate type FR-2, CEM-1, CEM-3, FR-4
Copper thickness 0.5OZ-5OZ
Circuit formation dry film, photo imageable ink, silk-screen
Solder mask photo imageable ink, oven-cured ink, UV ink, peelable, mask ink
Legend marking oven-cured ink, Uvink
Conductive paste carbon paste, silver paste
Surface treatment Hot air leveling, electro-nickel, electro-nickel/gold, electroless nickel gold, Entek, preflux
Outline formation CNC routing, die punching, V-CUT, beveling
Circuit test computerized circuit test 10V-300V, insulation resistance 1 to 40MΩ
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